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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
Compatible to Bonding / AuSn Soldering
GMD Series
This capacitor is compatible to wire bonding mounting by the external electrodes
of Au plating.
Features
C02E.pdf
Sep.25,2013
1
Can be mounted by wire bonding and AuSn soldering.
Since the external electrodes are based on the Au plating specification, mounting by wire/die bonding is possible.
Internal Electrodes
Ceramic
Au plated layer
Au/Sn solder
Au pad
Foundation Electrode Layer
Ni plated layer
<Example of Structure>
Au wire
Epoxy
<Mounting Example>
2
3
Ideal for mounting in packages, such as optical communication related devices , IC and etc.
Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved
with a built-in capacitor in the package, such as TO-CAN, IC and etc. by wire bonding mounting.
Contributes to the miniaturization of the set.
Murata offers a lineup of small size products, such as the 0603 (0201) and 1005 (0402) in mm (inch).
Specifications
Size
0.6×0.3mm to 1.0×0.5mm
e
g
e
Rated Voltage
DC6.3V to 50V
T
Capacitance
100pF to 1.0μF
L
W
Main Applications
1. Optical communication related equipment
2. Mounting in IC packages
<Dimensions>
This catalog contains only a portion of the product lineup.
Please refer to the capacitor search tool on the Murata Web site for details.
107
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